商標ウォッチ

公開日2025-10-16
公報種別公開国際商標公報
国際登録番号1870086
国際登録日2025-05-16
区分第1類(化学品),第9類(機械器具),第40類(製造・加工),第42類(科学・技術)
商品役務Silicon; semiconductor silicon; chemicals for the manufacture of semiconductors; chemical preparations for the manufacture of electronic components; chemical compositions for the development of computer chips; industrial chemicals for the manufacture of integrated circuits; chemical products for the electronics industry; chemicals for the manufacture of semiconductor chips; etchants for the manufacture of semiconductors; adhesives for industrial purposes in the form of chips; dopants for the manufacture of semiconductors; chemical starting material for the deposition of thin films on semiconductor wafers for the manufacture of semiconductors; chemical substances for the manufacture of printed circuit boards.,Semiconductors; semiconductor devices; semiconductor chips; semiconductor elements; semiconductor memory devices; semiconductor memory units; computer chipsets; integrated circuit chips; chips [integrated circuits]; silicon chips [electronic components]; electronic memory chips for integrated circuits; computer chipsets for transferring data to and from a central processing unit; computer software for developing integrated circuits; software for operating and managing integrated circuit components; integrated circuit memories; electronic memory circuits; integrated circuit memory cards; compilers; artificial intelligence software; artificial intelligence software for analysis; machine learning software; machine learning software for analysis; memory devices; memory modules; artificial intelligence software for vehicles; volatile memory; non-volatile memory; flash memory; computer memory devices; portable computers; portable computer hardware; portable computer peripherals; portable peripherals for computers; portable communication devices; mobile computers; augmented reality glasses; augmented reality headsets; hardware for augmented reality; smart glasses; smartphones; smartwatches; smart rings; smart cards; virtual reality glasses; virtual reality hardware; virtual reality headsets; AI hardware; AI chips.,Custom manufacturing of computer chips; custom manufacturing of integrated circuits; custom manufacturing of semiconductor components, devices and circuits; custom manufacturing and assembly services for semiconductor components and integrated circuits; custom manufacturing of AI hardware; semiconductor processing services; treatment and processing of semiconductors.,Integrated circuit design; computer hardware design; computer chip design and development; AI hardware design and development; computer hardware development; electronic circuit design engineering services; semiconductor manufacturing technical consulting; silicon photonics chip manufacturing technical research; semiconductor technology research and development; artificial intelligence research and development; artificial intelligence technology research; artificial intelligence consulting; provision of computer programs for artificial intelligence in data networks; artificial intelligence technology consulting; edge computing research; semiconductor processing technology research; semiconductor processing technology technical consulting; In-memory computing technology development; Software as a Service (SaaS).
基礎出願番号302024121579
基礎出願日2024-11-18
基礎出願国DE
出願人SEMRON GmbH
OCRテキストCapDRAM
OCRテキスト2
OCRについて

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