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公開日2025-02-05
公報種別公開国際商標公報
国際登録番号1825053
国際登録日2024-10-16
区分第1類(化学品)
商品役務Copper paste for industrial purposes, paste made of copper nanoparticles for use in industrial applications, copper paste for use in electronic and semiconductor manufacturing, copper paste used in thermal management for industrial applications, copper-based paste for use in via filling in printed circuit boards (PCBs), copper-based paste for use in IC substrate applications, copper-based paste for power management.
基礎出願番号98781948
基礎出願日2024-10-02
基礎出願国US
出願人MacDermid, Incorporated
OCRテキストCyprium
OCRテキスト2
OCRについて

この商標をJ-PlatPatで参照する

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