商標ウォッチ

公開日2025-01-16
公報種別公開国際商標公報
国際登録番号1820714
国際登録日2024-09-25
区分第7類(機械),第9類(機械器具),第35類(広告・事務),第37類(建設),第40類(製造・加工),第42類(科学・技術)
商品役務Machines and machine tools for the manufacturing, production and assembly of telecommunication hardware components, hardware components for telecommunications, hardware components for the telecommunications, semiconductor and space industries, hardware components for semiconductor, telecommunication and radar apparatus, instruments and devices, parts and fittings for hardware components for semiconductor, telecommunication and radar apparatus, instruments and devices, semiconductor hardware, devices, circuits, wafers, chips, memories, components and elements 全 175 件を表示, parts and fittings for semiconductor hardware, devices, circuits, wafers, chips, memories, components and elements, components and elements for semiconductor devices, including such using system-in-package (SiP) technology, as well as of filters and antennas as hardware, components and elements for semiconductor devices; parts, fittings and accessories for all of the aforesaid goods.,Downloadable software for telecommunications; downloadable software for the telecommunications, semiconductor and space industries; downloadable software for use in connection with semiconductors and semiconductor hardware; telecommunication hardware components; computer hardware components for telecommunications; computer hardware components for the telecommunications, semiconductor and space industries; hardware components for semiconductor, telecommunication and radar apparatus, instruments and devices; semiconductor hardware, devices, circuits, wafers, chips, memories, components and elements; components and elements for semiconductor devices, including such using system-in-package (SiP) technology; filters and antennas as hardware, components and elements for semiconductor devices; parts, fittings and accessories for all of the aforesaid goods.,Retail and wholesale services in relation to software for telecommunications, software for the telecommunications, semiconductor and space industries, software for use in connection with semiconductors and semiconductor hardware, telecommunication hardware components, hardware components for telecommunications, hardware components for the telecommunications, semiconductor and space industries, hardware components for semiconductor, telecommunication and radar apparatus, instruments and devices, parts and fittings for hardware components for semiconductor, telecommunication and radar apparatus, instruments and devices, semiconductor hardware, devices, circuits, wafers, chips, memories, components and elements, parts and fittings for semiconductor hardware, devices, circuits, wafers, chips, memories, components and elements, components and elements for semiconductor devices, including such using system-in-package (SiP) technology, as well as in relation to filters and antennas as hardware, components and elements for semiconductor devices; information, advice and consultancy in relation to all of the aforesaid services.,Installation, maintenance and repair services for telecommunication hardware components, hardware components for telecommunications, hardware components for the telecommunications, semiconductor and space industries, hardware components for semiconductor, telecommunication and radar apparatus, instruments and devices, parts and fittings for hardware components for semiconductor, telecommunication and radar apparatus, instruments and devices, semiconductor hardware, devices, circuits, wafers, chips, memories, components and elements, parts and fittings for semiconductor hardware, devices, circuits, wafers, chips, memories, components and elements, components and elements for semiconductor devices, including such using system-in-package (SiP) technology, as well as for filters and antennas as hardware, components and elements for semiconductor devices; information, advice and consultancy in relation to all of the aforesaid services.,Custom manufacturing of telecommunication hardware components for others; custom manufacturing of hardware components for telecommunications for others; custom manufacturing of hardware components for the telecommunications, semiconductor and space industries for others; custom manufacturing of hardware components for semiconductor, telecommunication and radar apparatus, instruments and devices for others; custom manufacturing of parts and fittings for hardware components for semiconductor, telecommunication and radar apparatus, instruments and devices for others; custom manufacturing of semiconductor hardware, devices, circuits, wafers, chips, memories, components and elements for others; custom manufacturing of parts and fittings for semiconductor hardware, devices, circuits, wafers, chips, memories, components and elements for others; custom manufacturing of components and elements for semiconductor devices, including such using system-in-package (SiP) technology, for others; custom manufacturing of filters and antennas as hardware, components and elements for semiconductor devices, for others; custom assembling of hardware components for semiconductor, telecommunication and radar apparatus, instruments and devices; information, advice and consultancy in relation to all of the aforesaid services.,Research, development, design and technical advice and consultancy services in relation to telecommunication hardware components, hardware components for telecommunications, hardware components for the telecommunications, semiconductor and space industries, hardware components for semiconductor, telecommunication and radar apparatus, instruments and devices, parts and fittings for hardware components for semiconductor, telecommunication and radar apparatus, instruments and devices, semiconductor hardware, devices, circuits, wafers, chips, memories, components and elements, parts and fittings for semiconductor hardware, devices, circuits, wafers, chips, memories, components and elements, components and elements for semiconductor devices, including such using system-in-package (SiP) technology, as well as in relation to filters and antennas as hardware, components and elements for semiconductor devices; information technology support services; software engineering services; installation, implementation, maintenance, repair, rental, programming, development, design, technical support, updating and upgrading of software for telecommunications, software for the telecommunications, semiconductor and space industries, and of software for use in connection with semiconductors and semiconductor hardware; information, advice and consultancy in relation to all of the aforesaid services.
基礎出願番号019004227
基礎出願日2024-03-25
基礎出願国EM
出願人TeraSi AB
OCRテキストTERASI
OCRテキスト2
OCRについて

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